UPM-NXP Collaboration To Boost Malaysia’s Competitiveness In Global Semiconductor Market

SERDANG, Oct 3 (Bernama) -- Universiti Putra Malaysia (UPM) and semiconductor giant NXP Malaysia have entered a strategic partnership to boost the growth of Malaysia’s semiconductor and electronics industry. 

This collaboration is set to strengthen the country’s position in the global supply chain, while enhancing local talent and innovation.

Science, Technology, and Innovation Minister Chang Lih Kang said that this initiative aligns with the ministry's Electrical and Electronics (E&E) Technology Development Roadmap 2021-2030. 

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"The roadmap underscores the importance of advanced technologies such as automation, artificial intelligence (AI), and the Internet of Things (IoT), which are pivotal in modernising the E&E sector and enhancing operational efficiencies," he said after witnessing the signing of a Memorandum of Agreement (MoA) between UPM and NXP Malaysia.

Launched today, the UPM-NXP collaboration lab will focus on nurturing local talent by providing students with direct access to cutting-edge semiconductor technologies. 

This initiative also positions Malaysia as a hub for semiconductor research and development (R&D), aligning with the global demand for integrated circuits used in key industries such as automotive, consumer electronics, and telecommunications.

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One of the core elements of the partnership is the establishment of a high-tech wire bonding machine in the UPM-NXP lab, a key tool in semiconductor manufacturing. 

"This equipment allows students to bridge the gap between academic knowledge and industry requirements, preparing them for high-demand roles in the global semiconductor sector," Chang explained.

He stressed that industry-academia collaborations are essential to keep educational programmes relevant to current market needs. 

"By aligning with technological trends and industry expectations, we are equipping students with the skills to drive innovation and growth in Malaysia's semiconductor industry," he added.

At the same time, the partnership supports the broader objectives of the recently launched National Semiconductor Strategy (NSS), which aims to elevate Malaysia in the global semiconductor value chain. 

The NSS’ ambitious targets include developing Malaysia into a global hub for semiconductor R&D and training 60,000 highly skilled engineers to meet the demands of the fast-growing industry.

UPM Vice-Chancellor, Datuk Prof Dr Ahmad Farhan Mohd Sadullah said the collaboration allows UPM to further solidify its research capabilities by providing access to state-of-the-art equipment.

 "This partnership opens the door for UPM to collaborate more extensively with global research institutions and industry leaders, which will enhance the quality of our research and create wider opportunities for our students," he noted.

By focusing on R&D and the development of local expertise, the UPM-NXP partnership is poised to propel Malaysia up the global semiconductor value chain. 

This collaboration is expected to generate substantial opportunities for local talent and drive Malaysia's competitiveness in a sector that is critical to the global economy.

-- BERNAMA