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Malaysia Semiconductor Recruitment Day 2024 Connects Job Seekers With Over 25 Companies

04/10/2024 09:42 PM

KUALA LUMPUR, Oct 4 (Bernama) -- More than 25 prominent companies are participating in the Malaysia Semiconductor Recruitment Day 2024 which kicked off here today, with over 2,000 graduates registered for the two-day event aimed at connecting job seekers with top industry players.

The Selangor Information Technology and Digital Economy Corporation (Sidec), which is organising the event in collaboration with Malaysia Advanced Semiconductor Academy, said this is a key milestone in Malaysia's journey to becoming a leader in the global semiconductor industry.

“The event is an excellent opportunity for job seekers to gain direct access to recruiters and hiring managers from top semiconductor companies. On-the-spot interviews are available, providing attendees the opportunity to secure their next career move. 

“The event also offers career consultations and workshops designed to help job seekers sharpen their application strategies and refine their professional development,” it said. 

Additionally, there are networking opportunities for attendees to connect with industry professionals and insiders, offering valuable insights and connections that could shape their future careers in the semiconductor industry.

According to the statement, the key participating companies include NXP, Renesas, Infineon, Inari Amertron, Neways, Vitrox, STMicroelectronics, HCLTech, Chipsbank, Betterlife, Oppstar, Synopsys, Skyechip, and AppAsia.

These companies are actively recruiting for roles such as RTL design engineer, design verification engineer, physical design engineer, analogue circuit design engineer, and layout design engineer, with a starting salary of RM5,000 for entry-level engineers.

“The participating companies deliver presentations to showcase their cutting-edge technologies, ongoing projects, and career development opportunities. It will provide attendees with valuable insights into the industry's future direction and the roles they could play in driving innovation forward,” Sidec said. 

-- BERNAMA 

 

 


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