GEORGE TOWN, Oct 17 (Bernama) -- Business Sweden Malaysia and the Malaysia Semiconductor Industry Association (MSIA) will collaborate to strengthen international cooperation in the semiconductor industry to accelerate innovation, sustainability, and supply chain resilience between the two nations, following the signing of a Memorandum of Understanding (MoU).
Business Sweden said this landmark agreement marks a strategic milestone in strengthening bilateral collaboration between Sweden and Malaysia, two innovation-driven economies committed to shaping the future of the global semiconductor landscape.
Trade Commissioner of Sweden to Malaysia Ludvig Hermansson said by deepening the collaboration in the semiconductor sector, both countries are laying the foundation for future innovation, resilience, and sustainable growth.
"Malaysia can leverage Sweden’s knowhow in sustainability and advanced manufacturing to enhance its semiconductor tech ecosystem and create a powerful synergy that will drive progress in one of the world’s most critical industries," he said.
The MoU outlines a framework for joint activities and initiatives that support closer partnerships in semiconductor research, development, innovation, manufacturing, design, and professional qualification.
The collaboration will focus on three key areas, namely ecosystem development, supply chain resilience, and business-driven innovation and technology exchange.
Meanwhile, MSIA executive director Andrew Chan said the collaboration will pave the way for new opportunities in advanced technology, sustainability, and talent development to drive the next phase of global semiconductor growth.
The partnership builds on Malaysia’s National Semiconductor Strategy under the New Industrial Master Plan 2030 which envisions the nation as a global hub for advanced semiconductor technologies, while Sweden’s strengths in Industry 4.0, sustainable manufacturing, and digitalisation complement Malaysia’s drive toward higher-value activities and long-term competitiveness.
-- BERNAMA
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