Nearfield Instruments Partners Imec To Advance 3D Semiconductor Metrology For AI-Chip Era

KUALA LUMPUR, Nov 19 (Bernama) -- Nearfield Instruments, the leader in 3D, non-destructive, in-line process control solutions, has announced a strategic collaboration with Imec to accelerate innovation in semiconductor metrology.

Nearfield Instruments Chief Executive Officer (CEO), Dr Hamed Sadeghian said: “Partnering with Imec allows us to push the boundaries of what is possible in semiconductor manufacturing process control.

“Together, we are tackling grand metrology challenges, from 3D profiling of CFETs to hybrid bonding characterisation, and enabling the next leap in High-NA EUV lithography through full 3D resist imaging.”

According to Nearfield Instruments in a statement, this collaboration marks a significant step forward in bridging cutting-edge metrology innovation with advanced semiconductor process development.

By combining Nearfield Instruments’ proven technology with Imec’s visionary research programmes, the partnership aims to deliver impactful solutions that will shape the future of chip manufacturing.

The partnership will deploy Nearfield’s QUADRA system at Imec’s advanced research and development (R&D) facility in Leuven to develop next-generation metrology solutions for High-NA EUV lithography, 3D logic device profiling, and heterogeneous integration, addressing critical challenges in precision, speed, and scalability for artificial intelligence (AI)-chip manufacturing.

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Based in Rotterdam, Netherlands, Nearfield Instruments specialises in advanced metrology and inspection solutions for the semiconductor industry, developing and commercialising next-generation scanning probe microscopy systems that deliver true 3D nanometre-scale metrology.

-- BERNAMA