AT&S AND IFC SIGN SUSTAINABILITY-LINKED LOAN AGREEMENT TO FINANCE INTEGRATED CIRCUIT SUBSTRATE PLANT IN MALAYSIA

LEOBEN, March 13 (Bernama) -- Today, the International Finance Corporation (IFC), a member of the World Bank Group and the largest global development institution focused on the private sector in emerging markets, and AT&S have signed a sustainability-linked loan agreement for 250 million US dollars at the AT&S headquarters in Leoben-Hinterberg. The loan supports investment in a modern integrated circuit (IC) substrate plant in Kulim, Malaysia. The 250 million US-dollar loan will come directly from IFC; an additional up to 150 million US dollars could be provided by local banks under the same agreement.

The sustainability-linked loan features financial incentives tied to AT&S lowering its annual greenhouse-gas emissions by 31 percent by the year ending March 31, 2028, compared to the baseline for fiscal year 2022.