TOKYO, April 16 (Bernama) -- NIPPON KINZOKU CO., LTD. (TOKYO: 5491) (Headquarters: Minato-ku, Tokyo) announced that it has developed the "FI (Fine Insulation) finish", a stainless steel with high surface insulation resistance.
In recent years, miniaturization and low-profile design have become increasingly prominent in electronic devices such as smartphones and game consoles. Until now, measures have been taken to avoid short circuits by installing insulating tape or resin composites at points that come into contact with conductive parts. However, these solutions have led to higher costs and have obstructed miniaturization, and low-profile design.
BERNAMA provides up-to-date authentic and comprehensive news and information which are disseminated via BERNAMA Wires; www.bernama.com; BERNAMA TV on Astro 502, unifi TV 631 and MYTV 121 channels and BERNAMA Radio on FM93.9 (Klang Valley), FM107.5 (Johor Bahru), FM107.9 (Kota Kinabalu) and FM100.9 (Kuching) frequencies.
Follow us on social media :
Facebook : @bernamaofficial, @bernamatv, @bernamaradio
Twitter : @bernama.com, @BernamaTV, @bernamaradio
Instagram : @bernamaofficial, @bernamatvofficial, @bernamaradioofficial
TikTok : @bernamaofficial
